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“IR-9000红外BGA返修台 拆焊台”参数说明
| 是否有现货： | 是 | 认证： | CE |
| 品牌： | HONTON | 升温时间： | 5（s）以下 |
| 温度调节范围： | 室温-400度 | 加工定制： | 是 |
| 焊台种类： | 拆焊台 | 适用范围： | 电子产品焊接 |
| 输入电压： | 220V | 外形尺寸： | 475*480*420 |
| 重量： | 20 | 型号： | IR-9000 |
| 规格： | 475*480*420MM | 商标： | HONTON |
| 包装： | 纸箱 | 产量： | 2000 |
“IR-9000红外BGA返修台 拆焊台”详细介绍
echnical Parameters
|
Basic Parameters |
|
|
Heating |
IR |
|
Dimension |
L475mmx W480mmx H420mm |
|
Weight |
16kg |
|
Total weight |
About 17 kg, vary with the differen need of the users |
|
Electrical Parameters |
|
|
Power |
220V AC |
|
Upper Heating |
IR |
|
Size of Upper heating |
80mm x 80mm |
|
Consumption of upper heating |
450W |
|
Bottom Heating |
IR |
|
Size of Bottom heating |
1800mm x1800mm |
|
Consumption of Bottom heating |
800W |
|
General power |
1250W |
|
Temperature Control |
|
|
Control mode of Upper |
Independent temperature control, high-precision closed-loopcontrol, precision ± 0.5%, Alarm |
|
Control mode of Bottom |
Independent temperature control, high-precision closed-loopcontrol, precision ± 0.5%, NO Alarm |
|
Rework Function |
|
|
SMD |
Suit for welding, remove or repair packaged devicessuch as BGA,PBGA,CSP,multi-layer substrates, EMImetallic shield product and solder/lead free Reworkwelding |
|
Size of applicable chips |
≤70mm x70 mm |
|
Size of applicable PCB |
≤400mm x305mm |
